We’re looking forward to hosting ICSP15 at Purdue University School of Materials Engineering on September 22-25, 2025.
With this in mind, we wanted to give you an update about the progress that’s been made to prepare for the conference.
First, the conference website (www.icsp15.org) has been operational for some time and is capable of accepting your abstract(s) for the technical program.
Professor David Johnson (ICSP15 Vice Chairman for the technical program) and myself have already reviewed and accepted a number of your submissions.
That said, we’re looking forward to having a robust slate of presentations from both academia and industry. The deadline for abstracts will be in the spring of 2025, similar to the timing of previous ICSP meetings, and the website will update with the deadline date this fall.
Next, the Local Organizing Committee for the conference has been selected and is comprised of the following people:
- Jennifer Brown – American Axle Manufacturing
- Mike Schmidt – General Electric Aerospace
- Steve Ferdon – Cummins
- Jim Whalen – Progressive Surface
- Eric Rossol – Sinto America
- Kumar Balan – Ervin Industries
- Shota Watanabe – Toyo Seiko
Also, we’re pleased to announce that the following companies have agreed to sponsor the conference:
- Presenting Sponsor – Electronics, Inc.
- Opening Reception – Progressive Surface
- Conference Dinner – Sinto America
- Lunch Sponsor – Toyo Seiko
- Lunch Sponsor – Ervin Industries
- Lunch Sponsor – Yamada Infra Technos Co., Ltd.
There are a few remaining sponsorships and anyone interested in discussing those and/or the remaining exhibitor spaces should contact ICSP15 Vice Chairman Mark Gruninger at mgruninger@purdue.edu.
For those of you looking at travel this far out, there is now a direct air service from Chicago-O’Hare to West Lafayette (airport code LAF), so getting here may be even easier than we had anticipated.
